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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/26 ? 20 1 7 rohm co., ltd. all ri ghts reserved. tsz22111 ? ? tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 rev. 001 dc brushless fan motor drivers multifunction single - phase full - wave fan motor driver BD61245EFV general description b d6124 5 e fv is a 1chip driver that is compose d of h - bridg e power dmos fet. moreover, t he circuit con figuration is restructured, and convenience has been improved b y reducing the external pa rts and simplifying the setting compared with the conventional driver . features ? high heat radiation p ackage ? driver i ncluding p ower dmos fet ? speed c ontrollable by dc / pwm i nput ? i/o d uty s lope a djust ? pwm s oft s witching ? current l imit ? s tart d uty a ssist ? lock p rotection and a utomatic r estart ? quick s tart ? rotation s peed p ulse s ignal (fg) o utput ke y specifications ? o perating voltage range: 4 v t o 16v ? o perating t emperature r a nge : C 40 c to + 10 5 c ? o utput v oltage (total): 0.2v (typ) at 0.4 a p ackage w (typ ) x d (typ ) x h (max) 5 .00mm x 6.40mm x 1. 00mm a pplications ? f an motors for general consumer equipment of desktop pc, projector, etc. t ypical application ci rcuit s ht ssop - b1 6 figure 1. application of d irect pwm i nput figure 2. application of dc v oltage i nput datashee t pwm m h sst out2 h + h C out1 v cc min zper adj ref rnf ssw pwm sig fg 1 gnd slp 2 3 1 5 1 4 1 3 1 2 4 5 6 7 8 1 1 10 9 16 dc m h sst out2 h + h C out1 v cc min zper adj ref rnf ssw pwm sig fg 1 gnd slp 2 3 1 5 1 4 1 3 1 2 4 5 6 7 8 1 1 10 9 16
. 2/26 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? ? BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 pin c onfiguration pin d escription i / o truth tab le h all input d river output h+ h C out1 out2 fg h l l h hi - z l h h l l h; high, l; low, hi - z; high impedance fg output is open - drain type. block diagram pin no. pin name function 1 fg speed pulse signal output terminal 2 h C hall C input terminal 3 h+ hall + input terminal 4 s s t soft start setting terminal 5 slp i /o duty slope setting terminal 6 pwm pwm input duty terminal 7 out2 motor output terminal 2 8 rnf output current detecting resistor connecting terminal (motor ground) 9 out1 motor output terminal 1 10 v cc power supply terminal 11 ref reference volta ge output terminal 1 2 min minimum output duty setting terminal 1 3 z per re - circulate period setting terminal 1 4 s sw soft switching setting terminal 15 adj output duty correction setting terminal 1 6 gnd ground terminal (signal ground) (top view) ssw min h+ out2 sst h C fg v cc ref adj slp gnd zper rnf 1 2 3 4 5 6 7 15 out1 pwm 16 8 14 13 12 11 9 10 hall bias hall bias sst out2 h + h C out1 vcc min zper adj tsd control logic osc filter ref refe - rence rnf pre - driver ssw pwm inside reg 1 5 1 4 1 3 1 2 2 3 4 5 6 7 8 1 1 10 9 fg signal output 1 gnd 16 + - co mp comp + - v cl slp a/d a/d a/d a/d a/d a/d a/d
. 3 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 absolute m aximum r atings parameter symbol rating u nit supply v oltage v cc 18 v po wer d issipation pd 0.95 (note 1) w operating t emperature r ange topr 40 to + 10 5 c sto rage t emperature r ange tstg 55 to + 150 c o utput v oltage v o max 18 v output c urrent i o max 1.8 (note 2) a rotation s peed p ulse s ignal (fg) o utput v oltage v fg 18 v ro tation s peed p ulse s ignal (fg) o utput c urrent i fg 10 ma reference voltage (ref) output c urrent i ref 10 ma i nput v oltage 1 ( h+, h , min, ssw, sst, zper ,sl p,adj) v in1 2.6 v i nput v oltage 2 ( pwm ) v in2 6.5 v junction t emperature tj 150 c (note 1) derate by 7.6 mw/c when operating over ta=25c. (note 2) do not exceed pd and tj=150 c. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins o r an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is opera ted over the absolute maximum ratings. thermal resistance (n ote 1) parameter symbol thermal resistance (typ) unit 1s ( note 3 ) 2s2p ( note 4) htssop - b16 junction to ambient j a 131.5 30.8 c /w junction to top characterization parameter ( note 2 ) jt 9 3 c /w (note 1) based on jesd 51 - 2a(still - air) (note 2) the thermal characterization parameter to report the difference between junc tion temperature and the temperature at the top center of the outside surface of the component package. (note 3) using a pcb board based on jesd 51 - 3. layer number of measurement board material board size single fr - 4 114.3mm x 76.2mm x 1.57mmt top copper pattern thickness footprints and t races 70 m (note 4) using a pcb board based on jesd 51 - 5, 7. layer number of measurement board material board size thermal via (note 5) pitch diameter 4 layers fr - 4 114.3mm x 76.2mm x 1.6mmt 1.20mm - 0.30mm top 2 internal layers bottom copper pattern thickne ss copper pattern thickness copper pattern thickness footprints and traces 70 m 74.2mm x 74.2mm 35 m 74.2mm x 74.2mm 70 m ( note 5 ) this thermal via connects with the copper pattern of all layers. .
. 4 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 recommend ed o perating c onditions parameter s ymbol min typ m ax u nit operating s upply v oltage v cc 4 12 16 v hall i nput voltage v h 0 - 2 v pwm input frequency f pwm 15 - 50 khz electrical characteristics (unless otherwise specified ta=25c, v cc =12v) p arameter s ymbol limit u nit c onditions characteristic d a ta m in t yp m ax circuit current i cc 1.8 3.3 4.8 ma figure 3 o utput v oltage v o - 0.2 0.4 4 v i o = 4 00 ma , high and low side total figure 4 to figure 7 lock d etection on t ime t on 0.3 0.5 0.7 s figure 8 lock d etection off t ime t off 3.0 5.0 7.0 s figu re 9 lock detection off/on ratio r lck 8 10 12 - r lck =t off / t on figure 10 hall input hysteresis voltage v hys +
. 5 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 typical performance curves (reference d ata) figure 4. output high voltage vs output source curre nt (v cc =12v) figure 3. circuit current vs supply voltage figure 6. output low voltage vs output sink current (v cc =12v) 1 0 5 c 25 c 40 c operating voltage range figure 5. output high voltage vs output source current (ta=25 c ) 10 5 c 25 c 40 c 16v 12v 4 v 10 5 c 25 c 40 c -0.60 -0.45 -0.30 -0.15 0.00 0.0 0.6 1.2 1.8 output source current: i o [a] output high voltage: v oh [v] 0 2 4 6 8 0 5 10 15 20 supply voltage: v cc [v] circuit current: i cc [ma] 0.00 0.15 0.30 0.45 0.60 0.0 0.6 1.2 1.8 output sink current: i o [a] output low voltage: v ol [v] -0.60 -0.45 -0.30 -0.15 0.00 0.0 0.6 1.2 1.8 output source current: i o [a] output high voltage: v oh [v]
. 6 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 typical performance curves (reference d ata) continued 10 5 c 25 c 40 c figure 7. output low voltage vs output sink current (ta=25 c ) figure 8. lock detection on time vs supply voltage figure 9. lock detection off time vs supply voltage 105 0.00 0.15 0.30 0.45 0.60 0.0 0.6 1.2 1.8 output sink current: io[a] output low voltage: v ol [v] 3.0 4.0 5.0 6.0 7.0 0 5 10 15 20 supply voltage: vcc[v] lock detection off time: t off [s] 0.3 0.4 0.5 0.6 0.7 0 5 10 15 20 supply voltage: vcc[v] lock detection on time: t on [s] 8.0 9.0 10.0 11.0 12.0 0 5 10 15 20 supply voltage: vcc[v] lock detection off/on ratio: r lck [s/s]
. 7 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 typical performance curves (reference d ata) continued 10 5 c 25 c 40 c figure 13. fg output voltage vs fg sink current (ta=25 c ) figure 14. fg output leak current vs fg voltage figure 11. hall input hysteresis voltage vs supply voltage 10 5 c 25 c 40 c 10 5 c 25 c 40 c 10 5 c 25 c 40 c operating voltage range operating voltage range figure 12. fg output low voltage vs fg sink current (v cc =12v) 16v 12v 4 v 0.0 0.1 0.2 0.3 0.4 0 2 4 6 8 10 fg sink current: i fg [ma] fg output low voltage: v fgl [v] 0.0 0.1 0.2 0.3 0.4 0 2 4 6 8 10 fg sink current: i fg [ma] fg output low voltage: v fgl [v] -40 -20 0 20 40 0 5 10 15 20 supply voltage: vcc[v] hall input hysteresis voltage: v hys [mv] -2 0 2 4 6 8 0 5 10 15 20 fg voltage: v fg [v] fg output leak current: i fgl [a]
. 8 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 typical performance cu rves (reference d ata) continued figure 15. pwm input hi gh current vs supply voltage (v pwm =5v) 10 5 c 25 c 40 c 10 5 c 25 c 40 c operating voltage range operating voltage range figure 16. pwm input low current vs supply voltage (v pwm = 0 v) 10 5 c 25 c 40 c figure 17. reference voltage vs supply voltage (v cc =12v) figure 18. reference voltage vs ref source current ( ta=25 c ) 1 6 v 12v 4 v operating voltage range 1.0 1.5 2.0 2.5 3.0 0.0 2.5 5.0 7.5 10.0 ref source current: i ref [ma] refarence voltage: v ref [v] 1.0 1.5 2.0 2.5 3.0 0 5 10 15 20 supply voltage: v cc [v] reference voltage: v ref [v] 0 3 6 9 12 0 5 10 15 20 supply voltage: v cc [v] pwm intput high current: i pwmh [a] -50 -40 -30 -20 -10 0 0 5 10 15 20 supply voltage: v cc [v] pwm intput low current: i pwml [a]
. 9 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 typical performance curves (reference d ata) continued 10 5 c 25 c 40 c figure 19. current limit setting voltage vs supply voltage operating voltage range 100 125 150 175 200 0 5 10 15 20 supply voltage: v cc [v] current limit setting voltage: v cl [mv]
. 10 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 a pplication circuit e xample s ( c onstant values are for reference) 1. pwm i nput a pplication this is the application example of di rect pwm input into pwm terminal. minimum rotational speed is set in min terminal voltage. when a function is not used, do not let the a/d converter input terminal open. application d esign n ote ( 1 ) please connect the by pass capacitor with reference to the value mentioned above. b ecause there is a possibility of the motor start - up failure etc. due to ic mal function. substrate d esign n ote ( 1 ) ic power(vcc), and motor outputs(out1, 2) l ines are made as wide as possible. (2) ic ground (gnd) line is common with the application ground except motor ground (i.e. hall ground etc.), and arranged near to ( ) land. ( 3 ) the bypass capacitor and/or zener diode are placed near to v cc pin. (4) h+ and h lines are arranged side by side and made from the hall element to ic as short as possible, because it is easy for the noise to influence the hall lines. figure 20. pwm input application reverse polarity protection measure against back emf maximum output voltage and current are 18 v and 1. 8 a respectively connect bypass capacitor near vcc terminal as much as possible. soft switching setting m inimum duty setting stabilization of ref voltag e r e - circulate setting hall bias is set acc ording to the amplitude of hall element output and hall input voltage range. protection of fg open - drain to limit motor current, the current is detected. note th e power consumption of sense re sistance. noise measures of substrate i /o duty slope setting soft start time setting i /o duty correction setting z pwm | m h hall bias sig 500 to 2 k 0 to 0.5 1 f t o 10 f 1k to 100k sst out2 h + h out1 vcc min zper adj tsd control logic osc filter ref refe - renc e rnf pre - driver ssw pwm inside reg 15 14 13 12 2 3 4 5 6 7 8 11 10 9 fg signal output 1 gnd 16 + - comp comp + - v cl slp a/d a/d a/d a/d a/d a/d 1k to 100k ref resistor divider ok hall bias a/d ref resistor pull - down (gnd short ) ok hall bias a/d ref resistor pull - up (re f short ) ok hall bias a/d ref hall bias a/d ng terminal open ( prohibited input )
. 11 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 a pplication circuit e xample s ( c onstant values are for reference) continued 2. dc v oltage i nput a pplication this is the application example of dc voltage into min terminal . minimum rotational speed setting is disable . when a function is not used, do not let the a/d converter input terminal open. figure 21 . dc voltage input application s hort the pwm terminal to gnd . 1 f t o 10 f z | m h hall bias sig 500 to 2 k 0 to 0.5 1k to 100k sst out2 h + h out1 v cc min zper adj tsd control logic osc filter ref refe - renc e rnf pre - driver ssw pwm inside reg 15 14 13 12 2 3 4 5 6 7 8 11 10 9 fg signal output 1 gnd 16 + - comp comp + - v cl slp a/d a/d a/d a/d a/d a/d 1k to 100k dc 0 ref resistor divider ok hall bias a/d ref resistor pull - down (gnd short ) ok hall bias a/d ref resistor pull - up (re f short ) ok hall bias a/d ref hall bias a/d ng terminal open ( prohibited input )
. 12 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 functional d escriptions 1. variable s peed o peration t here are 2 ways to control the speed of motor. (1) pwm control ( input pwm pulse into pwm terminal ) (2) voltage control ( input dc voltage into min terminal) both (1) and (2), o utpu t pwm frequency is 50khz. when computed duty is less than 5%, a driving signal is not output. (1) pwm operation by pulse input in pwm terminal the pwm signal from the controller can be input directly to ic in figure 22 . the output duty is controlled by the i nput pwm duty (figure 23) . refer to r ecommended operating conditions and e lectrical characteristics (p.4) for the input condition. internal power - supply voltage (in ternal reg; typ 5.0v) is impressed when the pwm terminal is open, it becomes 100% input of t he duty and equivalent, and a full torque is driven. there must be a pull - down resistance outside of ic to make it to torque 0 when the pwm terminal opens ( however, only at the controller of the complimentary output type. ). insert the protective resistanc e if necessary. 0 ref minimum output duty ( 128 steps ) 100 min input voltage [v] output minimum duty [%] 0.6 25 inside re g out1 pwm 5.0 v 1.0 v 2.5 v out2 low high low high low high h+ h 0.0 v gnd zero full motor torque : high impedance motor output on pwm protection r esistor motor unit driver pwm filter i nternal reg controller complimen - tary o utput hall bias input pwm duty [%] output pwm duty [%] 100 100 0 minimum duty
. 13 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 functional d escriptions continued (2) pwm o peration by dc i nput in min t erminal output duty is contr olled by input voltage from min terminal. output duty is 100 % when min terminal voltage is 2.4 v (typ), output duty is 0% when min terminal voltage is 0v. (if using slp function, it is not like this.) in voltage control mode, short the pwm terminal to gnd . please refer to input voltage 1 (p. 3 ) for the input condition of the min terminal. because terminal voltage becomes unsettled when min terminal is in an open state, like application of figure 26 , please be applied some voltage to min terminal. minimum ou tput duty cannot be set in voltage control. 2. input - output duty slope setting (slp) slope properties of input duty and output duty can be set with slp terminal like figure 2 8 . slp setting work in both mode, pwm control and voltag e control. the resolution is 7bit (128 steps). the voltage of slp terminal is less than 0. 3 v (typ), slope of input - output duty characteristic is fixed to 1. and fixed to 0 .5 in 0. 3 v to 0. 6 v (typ) (refer to figure 29 ). w hen slope setting is not set, pull - d own slp termina l. figure 26 . dc input application figure 27 . dc input operation timing chart figure 28 . a djust of slope of i/o duty figure 29 . relations of slp terminal voltage and the input - output duty slope characteristics 0. 6 0 ref 0.5 input - output duty s lope ( 128 steps ) 2 s l p input voltage [v] slope of input - output duty 1 1 .5 1 .2 1.8 0. 3 min pwm filter inside reg dc hall bias 200k (typ) a/d re f min 2.4 v 0% 100% low high h+ h 0.0 v gnd zero full motor t orque out2 d uty out1 low : high i mpedance m otor output on high pwm input duty [%] 100 100 0 slope setting slope =2 slope =0.5 output duty [%]
. 14 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 functional d escriptions continued 3. input and output duty properties adjustment f unction (adj) when input duty vs output duty shows the characteristic of the straight line, rotational speed may become the characteristics that middle duty area swells by the charac teristic of fan motor. (figure 30 ) figure 30 . properties curve of input pwm duty vs rotational speed this ic reduces duty in the middle duty area and can adjust rotational speed c haracteristics of the motor with a straight line. figure 31 . properties curve of input pwm duty vs rotational speed after adjusting the ad justment to reduce duty is performed by adj terminal input voltage. the adj terminal is input terminal of a/d converter and the resolution is 7 bit . by input 0 (adj=gnd) of the adj terminal , the characteristic of input duty vs. output duty becomes straight line (no adjustment). the adjust ment become maximum by input 127 ( adj=ref ) , and output duty in input duty 50% decreases to about 25%. figure 32 . input duty vs output duty characteristics please set the voltage of adj terminal so that motor rotation speed in input duty 50% is on the diagonal which links the rotation speed of 0% to 100%. ic corrects output duty so that overall rotation speed properties match a straight line. when it is used together with slp function, at first adj adjustment is performed in slope=1, and please adjust slp after adjustin g input duty vs. rotation speed property. output duty rotational speed output duty rotational speed
. 15 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 functional d escriptions continued 4 . about setting of phase switching of output the period of soft switching and re - circulate can be adjusted by ss w and zper setting. (1) soft s witching period s etting (ssw) angle of the soft switching can be set by the inp ut voltage of ssw terminal. when o ne period of the hall signal is assumed 360 , the angle of the soft switching can be set fr om 22.5 to 90 by t he input voltage of ssw terminal (refer to figure 33 ). resolution of ssw terminal is 128 steps. operational image is shown in figure 34 . * soft switching angle means the section where output duty changes between 0% and setting duty at the timing of output phase change. to smooth off the current waveform, the coefficient table that duty gradually changes is set inside ic, and the st ep is 16. (2) re - circulate period setting (zper) re - circulat e angle at the timing of output phase chan ges can b e set by the input voltage of zper terminal. when one period of the hall signal is assumed 360 , the angle of the re - ci r culate can be set from 0 to 90 by the input voltage of zper terminal (refer to figure 35 ). r esolution of zper terminal is 128 steps. operational image is shown in figure 36 . when angular degree to regenerate is bigger than soft switching angular degree, a soft switching section for 5.6 degrees enters. * re - circulate angle means the section where the coil current re - circulate bef ore the timing of output phase change. if it is set appropriately, it is effective to suppress leaping up of voltage by bemf, and reduce invalid electricity consumption. the logic of the output transistor in the section is decided depending on the hall inp ut logic. as for the output of the h logic, the logic of the motor output in high impedance (hi - z). the output of the l logic remains l. figure 36 . re - circulate angle figure 34 . soft switchin g angle figure 33 . relation of ssw terminal voltage and soft s witching period figure 3 5 . relation of zper terminal voltage and re - circulate period h+ h low high low high motor current 0a out 1 out2 angle range of soft switching one period of hall signal 360 0. 6 0 ref 22.5 s et of soft switching period ( 128 s teps ) 90 s sw input voltage [v] 45 67.5 1 .2 1.8 angle[ ] 0. 6 0 ref 22.5 zper re - circulate angle ( 128 s teps ) 90 z per input voltage [v] 45 67.5 1 .2 1.8 angle[ ] h+ h low high low high motor curren t 0a out 1 out2 angle range of re - circulate one period of hall signal 360 s oft switching period re - circulate period ( max 90)
. 16 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 functional d escriptions continued (3) kickback restraint function when there is induced c urrent to the motor coil , regenerat ive current flows to the power supply. however, when reverse connection protection diode is connected, v cc voltage rises because the diode prevents current flow to power supply. (figure 37) the kick back restraint function is a supporting function to reduce induced current in a motor coil. to the specifications of the motor, please adjust soft switching p eriod (ssw) and r e - circulate p eriod (zper) to reduce leaping up of the output voltage. by specif ications and how to use motor, it may not reduce this induced current. for example, it becomes the severe condition in the motor startup. i n this case leaping up of the voltage decreases when it sets soft start time for a long time . figure 37 . v cc voltage rise by back electromotive force on phase s wit c h ing on on on
. 17 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 functional d escrip tions continued 5 . soft start soft start function gradual ly change drive duty to suppress sound noise and peak current when the motor start up etc . pwm duty resolution is 7 bit ( 128 steps, 0. 78 % per step). sst terminal sets the step up time of duty increm ent. duty transition time is (difference of current duty and t a rget duty (output duty after slp/adj calculation) ) x (step time) when soft start time is set for a long time, lock protection may be detected without enough motor torque when motor start up from 0% duty. therefore start up duty is set to approximatel y 20% ( 25 / 128 ). when sst terminal voltage = ref terminal voltage, and 100% dut y is input on motor stop condition, output duty arrives at 100% after progre ss the time of 76.2 ms x ( 128 - 25 step) = 7. 84 seconds soft s tart functions always work when the change of input duty as well as motor start up. in addition, it works when duty goes down from high duty. duty step down time is the half of duty step up time. 6 . start duty assist it is the function that enable the motor to start even if drive duty output is low, when the soft start function is not used. when input duty is within 50% at motor stop condition, 50% duty is o utput til l three times of hall signal change are detected. operati onal image is shown in figure 40 . s tart with input duty 50% figure 3 8 . relations of sst terminal voltage and soft start step up time start with input duty 100% figure 39 . s oft start operation image from motor stop condition figure 40 . start duty assist operation at input duty 10% pwm input drive pwm duty soft start section 5 0% 2 0% 5 0% power on i nput duty 50% 0% fg 1 0% hall detect 5 0% output duty 10% s oft start step up time [ms ] 0 .6 0 v ref 19.1 s oft start step up time ( 128 steps ) 76.2 sst input voltage [v] 38.1 57.2 1 .2 1.8 2 0% pwm input drive pwm duty soft start section 100% 10 0%
. 18 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 functional d escriptions continued 7 . current l imit current limit function turns off the output when the current flow through the motor coil is detected exceeding a set value . the working current value of the limit is determined by current limit voltage v cl and rnf t erminal voltage. the value of the current sense resistor is included in not only the r nf resistor but also wire resistance in the ic (rwire=approximately 10m current limit comp gnd motor gnd line r nf | ic signal gnd line v cl out1 out2 rnf i o m hall bias rwire r line t off ( t yp 5 .0s) low high : high impedance out1 low high low high h+ h 0% motor output on d uty out2 fg low high t on ( t yp 0.5s) t on t off motor l ock lock d etection motor lock r eleas e motor idling t on t off instruction torque
. 19 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 2v gnd hall input voltage range functional d escriptions continued 9 . q uick start when torque off logic is input by the control signal over a fixed time, the lock protection function is disabled. the motor can restart quickly once the control signal is applied. 10 . hall input setting the input voltage of a hall signal is input in "hall input volta ge" in p. 4 including sign al amplitude. in order to detect rotation of a motor, the amplitude of hall signal more than "hall input hysteresis voltage " is required. in put the hall signal more than 3 4 mvpp at least. figure 4 4 . h all input voltage range disable enable pwm low high low high h+ h 0% under 5 ms (typ) torque off motor stop torque on lock protection signal motor i dling pwm or min torque motor output on d uty quick start s tandby mode
. 20 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 i/o e quivalence c ircuit ( r esistance v alues are t ypical) 1. power supply terminal 2. pwm input dut y terminal 3. hall input terminal 4. a/d converter input terminal 5. reference voltage 6. motor output terminal output terminal output current detecting resistor connecting terminal 7. rotation speed pulse signal o utput terminal fg hall bias ref v cc hall bias sl p ssw hall bias min zper v cc gnd hall bias pwm inside reg inside reg hall bias 200 k h+ h hall bias v cc out1 out2 rnf
. 21 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 safety m easure 1. reverse c onnection p rotection d iode reverse connection of power results in ic destruction as shown in fig ure 46 . when reverse connection is possible, reverse connection protection diode must be added be tween power supply and v cc . 2. protection against v cc v oltage r ise by b ack e lectromotive f orce back electromotive force (back emf) generates regenerative current to power supply. however, when reverse connection protection diode is connect ed, v cc voltage rises because the diode prevents current flow to power supply. when the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place (a) capacitor or (b) zener diode between v cc and gn d. if necessary, add both (c). 3. problem of gnd line pwm s witching do not perform pwm switching of gnd line because gnd terminal potential cannot be kept to a minimum. 4. protection of rotation s peed p ulse (fg) o pen - d rain o utput fg outpu t is an open drain and requires pull - up resistor. adding resistor can protect the ic. exceeding the absolute maximum rating, when fg terminal is directly connected to power supply, could damage the ic. figure 46 . flow of current when power is connected reversely fi g ure 47 . v cc voltage rise by back electromotive force fi g ure 48 . measure against v cc and motor driving outputs v oltage fig ure 49 . gnd line pwm switching prohibited fig ure 5 0 . protection of fg terminal i/o vcc gnd in normal energization internal circuit impedance is high ? amperage small circuit block i/o gnd reverse power connection large current flows ? thermal destruction circuit block vcc i/o gnd after reverse connection destruction prevention no destruction circuit block vcc on phase switching on on on on on on on on on (a) capacitor (b) zenner diode (c) capacitor & zenner diode vcc gnd prohibit motor driver controller pwm input m hall bias fg driver protection resistor motor unit pull - up resistor sig connector hall bias
. 22 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 power dissipation 1. power dissipati on power dissipation (total loss) indicates the power that can be consumed by ic at ta=25 c (normal temperature). ic is heated when it consumes power, and the temperature of ic chip becomes higher than ambient temperature. the temperature that can be accep ted by ic chip into the package, that is junction temperature of the absolute maximum rating, depends on circuit configuration, manufacturing process, etc . power dissipation is determined by this maximum joint temperature, the thermal resistance in the sta te of the substrate mounting, and the ambient temperature . therefore, when the power dissipation exceeds the absolute maximum rating, the operating temperature range is not a guarantee. the maximum junction temperature is in general equal to the maximum va lue in the storage temperature range. 2. thermal resistance heat generated by consumed power of ic is radiated from the mold resin or lead frame of package. the parameter which indicates this heat dissipation capability (hardness of heat release) is call ed thermal resistance . i n the state of the substrate mounting , t hermal resistance from the chip junction to the ambien ce is shown in ja [ c /w] , and thermal characterization parameter from junction to the top center of the outside surface of the component package is shown in jt [ c /w] . thermal resistance is classified into the package part and the substrate part, and thermal resistance in the package part depends on the composition materials such as the mold resins and the lead frames. on the other hand, t hermal resistance in the substrate part depends on the substrate heat dissipation capability of the material, the size, and the copper foil area etc. therefore, thermal resistance can be decreased by the heat radiation measures like installing a heat sink etc. in the mounting substrate. the thermal resistance model is shown in figure 51 , and equation is shown below. ja = (tj ta) / p [ o c/w] jt = (tj tt) / p [ o c/w] where : ja is the thermal resistance from junction to ambien t [ o c/w] jt is the thermal characterization parameter from junction to the top center of the outside surface of the component package [ o c/w] tj is the junction temperature [ o c] ta is the ambient temperature [ o c] tt is the package outside surface (top center) temperature [ o c] p is the power consumption [w] (yhqlilwxvhvwkhvdphsdfndjh ja and jt are changed depending on the chip size, power consumption, and the measurement environments of the ambient temperature, the mounting condition, and the wind velocity, etc. 3. thermal de - rating curve thermal de - rating curve indicates power that can be consumed by ic with reference to ambient t emperature. power that can be consumed by ic begins to attenuate at certain ambient temperature (25 c ), and becomes 0w at the maximum joint temperature (150 c ). the inclination is reduced by the reciprocal of thermal re vlvwdqfhmd the t hermal de - rating curve under a condition of thermal resistance (p.3) is shown in figure 52 . figure 51 . thermal resistance model of surface mount figure 5 2 . power dissipation vs ambient temperature operating temperature range - 1/ ja = - 7.6 mw/ c 0.0 0.2 0.4 0.6 0.8 1.0 -50 -25 0 25 50 75 100 125 150 ambient temperature: ta[c] power dissipation: pd[w] junction temperature: tj[ c ] p ackage outside surface (top center ) t emperature : t t [ c ] mou n ting substrate hall bias ambient temperature: ta [ c ] ja [ c /w ] jt [ c /w ]
. 23 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 operational notes 1. r everse c onnection of p ower s upply connecting the power supply in reverse polarity can damage the ic. t ake pr ecautions against reverse polarity when connecting the power supply , such as mounting an external diode between the power supply and the ic ? s power supply pin s. 2. power s upply l ines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. g round voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. however, pins that drive inductive loads (e.g. motor driver outputs, dc - dc converter outputs) may inevitably go below ground due to back emf or electromotive force. in such cases, the user should make sure tha t such voltages going below ground will not cause the ic and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and pcb wiring to name a few. 4. g round w irin g p attern when using both small - signal and large - current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small - signal ground caus ed by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal c onsideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rati ng. 6. recommended o perating c onditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the e lectrical characteristics are guaranteed under the conditions of each parameter . 7. inrush curren t when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, g ive special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation u nder s trong e lectromagnetic f ield operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction . 9. testing on a pplication b oards when testing the ic on an application board, connecting a capacitor directly to a low - impedance output pin may vxemhfwwkh,&wrvwuhvv$ozd\vglvfkdujhfdsdflwruvfrpsohwho\diwhuhdfksurfhvvruvwhs7kh,&?v power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage.
. 24 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 operational notes continued 10. inter - pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each oth er especially to ground , power supply and output pin . inter - pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charg e acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. re garding the i nput p in of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p - n junctions are formed at the intersection of the p layers with the n layers of other elements, crea ting a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p - n junction operates as a parasitic diode. when gnd > pin b, the p - n junction operates as a parasitic transistor. parasitic diodes inevitab ly occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore , conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. fig ure 5 3 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal s hutdo wn (tsd) c ircuit this ic has a built - in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always eh zlwklq wkh ,&?v srzhu glvvlsdwlrq udwlqj ,i krzhyhu wkh udwlqj lv h[fhhghg iru d frqwlqxhg shulrg wkh mxqfwlrq tempera ture will rise which will activate the tsd circuit that will turn off all output pins. when the junction temperature falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situati on that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. n n p + p n n p + p s u b s t r a t e g n d n p + n n p + n p p s u b s t r a t e g n d g n d p a r a s i t i c e l e m e n t s p i n a p i n a p i n b p i n b b c e p a r a s i t i c e l e m e n t s g n d p a r a s i t i c e l e m e n t s c b e t r a n s i s t o r ( n p n ) r e s i s t o r n r e g i o n c l o s e - b y p a r a s i t i c e l e m e n t s
. 25 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 ordering information marking d iagram 6 1 2 4 5 ht ssop - b16 (top view) part number lot numbe r 1pin mark b d 6 1 4 5 f e part number package ? - 2 2 ? e
. 26 / 2 6 ? 20 1 7 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.com BD61245EFV tsz02201 - 0h1h0b101810 - 1 - 2 20.feb.2017 re v. 001 physical dimension , tape and reel information package name ht ssop - b 16
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our p roducts are designed and manufactured for application in ordinary electronic equipment s ( such as av equipment, oa equipment, telecommunication equipment, home elec tronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely high reliability ( such as medical equipment ( n ote 1 ) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, f uel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ) , please consult with the rohm sales represe ntative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific appl ications. ( n ote1) m edical e quipment c lassification of the s pecific applications japan usa eu china class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail - safe design against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our p roducts are designed and manufactured for use under standard conditions a nd not under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms p roduct s under any special or extraordinary environments or conditions . if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, pri or to use, must be necessary : [a] use of our products in any types of liquid, including water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the p roducts are exposed to direct sunlight or dust [c] use of our prod ucts in places where the p roducts are exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the p roducts are exposed to static electricity or electromagnetic waves [e] use of our products in p roximity to heat - producing components, plastic cords, or other flammable items [f] s ealing or coating our p roducts with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no - clean type fluxes, cleanin g residue of flux is recommended); or washing our products by using water or water - soluble cleaning agents for cleaning residue after soldering [h] use of the p roducts in places subject to dew condensation 4 . the p roducts are not subject to radiation - proo f design . 5 . please verify and confirm characteristics of the final or mounted products in using the products. 6 . in particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of pe rformance characteristics after on - board mounting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating under steady - state loading condition may negatively affect product performance and reliability. 7 . de - rate power dissipation d epending on a mbient temperature . when used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range described in the product specification. 9 . rohm shall not be in any way responsible or liable for f ailure induced under devian t condition from what is defined in this document . precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface - mount products, the flow soldering method must be used on a through hole mount products. i f the flow soldering method is preferred on a surface - mount products , please consult with the roh m representative in advance. for details , please refer to rohm mounting specification
notice - p ga - e rev.00 3 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, please allow a sufficient margin considerin g variations of the characteristics of the p roducts and external components, including transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and associated data and information contained in t his document are presented only as guidance for products use . therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in t his document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this p roduct is e lectrostatic sensitive product, which may be damaged due to e lectrostatic discharge. please take proper caution in your manufacturing process and stor age so that voltage exceeding the product s maximum rating will not be applied to p roducts. please take special care under dry condition (e .g. grounding of human body / equipment / solder iron, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the p roducts are stored in the places where : [a] the p roducts are exposed to sea winds or corrosive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm solderability before using p roducts of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excess ive stress applied when dropping of a carton. 4. use p roducts within the specified time after opening a humidity barrier bag. baking is required before using p roducts of which storage time is exceeding the recommended storage time period . precaution for p roduct l abel a two - dimensional barcode printed on rohm p roduct s label is for rohm s internal use only . precaution for d isposition when disposing p roducts please dispose them properly using a n authorized industry waste company. precaution for foreign e xchange and foreign t rade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information an d data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party reg arding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the combination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the information contained in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the products, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassemble d, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. i n no event shall you use in any way whatso ever the products and the related technical information contained in the products or this document for any military purposes , including but not limited to, the development of mass - destruction weapons . 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number BD61245EFV package htssop-b16 unit quantity 2500 minimum package quantity 2500 packing type taping constitution materials list inquiry rohs yes BD61245EFV - web page distribution inventory

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